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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>23/30436874 DC BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
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immediate downloadReleased: 2023-10-23
23/30436874 DC BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity

23/30436874 DC

BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity

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Standard number:23/30436874 DC
Pages:14
Released:2023-10-23
Status:Draft for Comment
DESCRIPTION

23/30436874 DC


This standard 23/30436874 DC BS EN IEC 62878-2-603. Device embedding assembly technology is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies

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