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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>24/30499026 DC BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad and unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
immediate downloadReleased: 2024-08-16
24/30499026 DC BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad and unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

24/30499026 DC

BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad and unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

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Standard number:24/30499026 DC
Pages:24
Released:2024-08-16
Status:Draft for Comment
DESCRIPTION

24/30499026 DC


This standard 24/30499026 DC BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 31.180 Printed circuits and boards

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