ASTM D1676-24 - Standard Test Methods for Film-Insulated Magnet Wire
Standard Test Methods for Film-Insulated Magnet Wire
| Standard number: | D1676-24 |
| Released: | 01.09.2024 |
| Status: | Active |
| Pages: | 36 |
| Section: | 10.01 |
| Keywords: | bond strength; burnout; chemical resistance; coefficient of friction; continuity; completeness of cure; cut-through temperature; dielectric; dimensional measurement; dissipation factor; elastic ratio; electrical resistance; elongation; extractables; film adherence; film-insulated conductor; formability; heat shock; hydrolytic stability; low stress elongation; magnet wire; oiliness; overload resistance; scrape resistance; solderability; springback; thermoplastic flow; resistance to insulating liquids; |
1.1 These test methods cover procedures for testing film-insulated magnet wire that is used in electrical apparatus. These test methods are intended primarily for the evaluation of the electrical insulating materials used. The intent is that these test methods be used, except where modified, by individual specifications for particular applications.
1.2 These test methods present different procedures for evaluating given properties of round, rectangular or square, copper or aluminum film-insulated magnet wire.
1.3 The values stated in inch-pound units are the standard. The SI units in parentheses are provided for information only.
1.4 The test methods appear in the following sections:
|
| Sections |
| Bond Strength | 4 – 12 |
| Burnout (AC Overload Resistance) | 13 – 21 |
| Chemical Resistance | 22 – 28 |
| Coefficient of Friction | 29 – 37 |
| Continuity, DC High Voltage | 38 – 45 |
| Continuity, DC Low Voltage | 46 – 53 |
| Completeness of Cure | 54 – 60 |
| Cut-Through Temperature (Thermoplastic Flow) | 61 – 68 |
| Dielectric Breakdown AC Voltage | 69 – 75 |
| Dielectric Breakdown AC Voltage after Bending | 76 – 82 |
| Dielectric Breakdown AC Voltage at Elevated Temperatures | 83 – 89 |
| Dielectric Breakdown AC Voltage after Conditioning in Refrigerant Atmosphere | 90 – 99 |
| Dimensional Measurement | 100 – 106 |
| Dissipation Factor Measurement | 107 – 114 |
| Electrical Resistance | 115 – 121 |
| Elongation | 122 – 129 |
| Extractables, Refrigerant | 130 – 140 |
| Film Adherence and Flexibility | 141 – 148 |
| Formability: |
|
| a) Elastic Ratio | 152 |
| b) Low Stress Elongation | 153 |
| c) Spring Back | 154-155 |
| Heat Shock | 156 – 162 |
| Oiliness | 163 – 169 |
| Scrape Resistance, Unidirectional | 170 – 177 |
| Solderability | 178 – 185 |
| Resistance to Insulating Liquids and Hydrolytic Stability | 186 – 195 |
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. Specific hazard statements are given in 9.5, 19.1, 19.3, 19.8, 52.1, 58, 59.1, 74.1, 112.1, 135.4, and 182.3.
Note 1: This test method is related to IEC 60851. Since both methods contain multiple test procedures, many procedures are technically equivalent while others differ significantly.
1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.