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Released: 01.03.2019
ASTM D5213-19 - Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications
Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications
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| Standard number: | ASTM D5213-19 |
| Released: | 01.03.2019 |
| Status: | Active |
| Pages: | 7 |
| Section: | 10.02 |
| Keywords: | conditioning; dielectric strength; dissipation factor; elongation; FEP fluorocarbon; film; fluorinated poly(ethylene-propylene); heat-seal strength; heatsealable; permittivity; polyetherimide; polyethylene naphthalate; polyethylene terephthalate; polyimide; poly(N; N`-p; p`-oxydiphenylene biphenyltetracarboxylimide); poly(N; N`-p; p`oxydiphenylene pyromellitimide); poly(N; N`-p-phenylene biphenyltetra-carboxylimide); shrinkage; tensile strength; thickness; volume resistivity; |
DESCRIPTION
1.1 This specification covers requirements for the material, dimensions and tolerances, and property values of film, in sheet or strip form, with or without heat-sealable coatings.
1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
Note 1: This document is similar to IEC 60674, Part 3, Sheets 2, 4, 5, 6, and 7.
1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.