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immediate downloadReleased: 1980-04-30
BS 5909:1980
Method for scale adhesion test for oxygen-free copper
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| Standard number: | BS 5909:1980 |
| Pages: | 6 |
| Released: | 1980-04-30 |
| ISBN: | 0 580 11265 9 |
| Status: | Standard |
DESCRIPTION
BS 5909:1980
This standard BS 5909:1980 Method for scale adhesion test for oxygen-free copper is classified in these ICS categories:
- 77.040.99 Other methods of testing of metals
This International Standard specifies a procedure for the scale adhesion testing of oxygen-free high-conductivity copper.
Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.