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immediate downloadReleased: 2019-09-11
BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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| Standard number: | BS EN 60068-2-69:2017+A1:2019 |
| Pages: | 60 |
| Released: | 2019-09-11 |
| ISBN: | 978 0 539 00016 0 |
| Status: | Standard |
DESCRIPTION
BS EN 60068-2-69:2017+A1:2019
This standard BS EN 60068-2-69:2017+A1:2019 Environmental testing is classified in these ICS categories:
- 19.040 Environmental testing
- 31.190 Electronic component assemblies
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).