BS EN 60068-2-69:2017+A1:2019 Environmental Testing Standard

Welcome to the comprehensive guide on the BS EN 60068-2-69:2017+A1:2019 standard, a crucial document for professionals in the field of electronic component and printed board testing. This standard is an essential tool for ensuring the reliability and quality of electronic components through rigorous solderability testing using the wetting balance (force measurement) method.

Overview of the Standard

The BS EN 60068-2-69:2017+A1:2019 standard provides detailed procedures for conducting environmental tests, specifically focusing on the solderability of electronic components and printed boards. This standard is part of the broader BS EN 60068 series, which addresses various environmental testing methods to ensure the durability and performance of electronic products under different conditions.

Key Features

• Standard Number: BS EN 60068-2-69:2017+A1:2019
• Pages: 60
• Release Date: September 11, 2019
• ISBN: 978 0 539 00016 0
• Status: Standard

Importance of Solderability Testing

Solderability testing is a critical process in the electronics manufacturing industry. It ensures that electronic components and printed circuit boards (PCBs) can be reliably soldered, which is vital for the functionality and longevity of electronic devices. The wetting balance method, as outlined in this standard, is a precise technique that measures the force required to wet a component or board with solder, providing valuable data on the quality of the solder joint.

Benefits of Using the Wetting Balance Method

The wetting balance method offers several advantages over other solderability testing techniques:

• Accuracy: Provides precise measurements of the wetting force, allowing for detailed analysis of solderability.
• Repeatability: Ensures consistent results across multiple tests, enhancing the reliability of the data.
• Comprehensive Analysis: Offers insights into the dynamics of the soldering process, helping identify potential issues before they affect production.

Who Should Use This Standard?

The BS EN 60068-2-69:2017+A1:2019 standard is indispensable for a wide range of professionals, including:

• Quality Assurance Engineers: Ensuring that components meet the required solderability standards.
• Manufacturing Engineers: Optimizing soldering processes to improve product reliability.
• R&D Specialists: Developing new products with enhanced solderability characteristics.
• Compliance Officers: Verifying that products adhere to industry standards and regulations.

Detailed Content of the Standard

This 60-page document is meticulously structured to provide comprehensive guidance on solderability testing. It includes:

• Introduction: An overview of the importance of solderability testing and the scope of the standard.
• Test Methods: Detailed descriptions of the wetting balance method, including equipment setup, test procedures, and data interpretation.
• Performance Criteria: Specifications for acceptable solderability performance, ensuring components meet industry standards.
• Appendices: Additional resources and references to support the implementation of the standard.

Why Choose BS EN 60068-2-69:2017+A1:2019?

Adopting the BS EN 60068-2-69:2017+A1:2019 standard offers numerous benefits to organizations involved in the design, manufacturing, and testing of electronic components:

• Enhanced Product Quality: By ensuring components meet solderability standards, manufacturers can produce more reliable and durable products.
• Reduced Risk of Failure: Identifying solderability issues early in the production process minimizes the risk of product failures in the field.
• Compliance with Industry Standards: Adhering to recognized standards demonstrates a commitment to quality and compliance, enhancing brand reputation.
• Cost Savings: By preventing defects and reducing rework, organizations can achieve significant cost savings in production.

Conclusion

The BS EN 60068-2-69:2017+A1:2019 standard is an essential resource for any organization involved in the electronics industry. By providing a detailed framework for solderability testing, it helps ensure the quality and reliability of electronic components and printed boards. Whether you are a quality assurance engineer, a manufacturing specialist, or a compliance officer, this standard is a valuable tool for achieving excellence in electronic product manufacturing.

BS EN 60068-2-69:2017+A1:2019

• 19.040 Environmental testing
• 31.190 Electronic component assemblies

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).