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Homepage>BS Standards>19 TESTING>19.040 Environmental testing>BS EN 60068-2-83:2011 Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

BS EN 60068-2-83:2011

Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

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Standard number:	BS EN 60068-2-83:2011
Pages:	42
Released:	2011-11-30
ISBN:	978 0 580 58835 8
Status:	Standard

DESCRIPTION

BS EN 60068-2-83:2011

This standard BS EN 60068-2-83:2011 Environmental testing is classified in these ICS categories:

19.040 Environmental testing
31.190 Electronic component assemblies

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

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