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Homepage>BS Standards>01 GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION>01.100 Technical drawings>01.100.25 Electrical and electronics engineering drawings>BS EN 60191-6-17:2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
immediate downloadReleased: 2011-06-30
BS EN 60191-6-17:2011 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

BS EN 60191-6-17:2011

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

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Standard number:BS EN 60191-6-17:2011
Pages:32
Released:2011-06-30
ISBN:978 0 580 57621 8
Status:Standard
DESCRIPTION

BS EN 60191-6-17:2011


This standard BS EN 60191-6-17:2011 Mechanical standardization of semiconductor devices is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
  • 01.100.25 Electrical and electronics engineering drawings
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
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