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immediate downloadReleased: 2010-10-31
BS EN 60191-6-18:2010
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
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| Standard number: | BS EN 60191-6-18:2010 |
| Pages: | 24 |
| Released: | 2010-10-31 |
| ISBN: | 978 0 580 71947 9 |
| Status: | Standard |
DESCRIPTION
BS EN 60191-6-18:2010
This standard BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices is classified in these ICS categories:
- 31.080.01 Semiconductor devices in general
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.