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immediate downloadReleased: 2010-12-31
BS EN 60191-6-21:2010
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
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| Standard number: | BS EN 60191-6-21:2010 |
| Pages: | 18 |
| Released: | 2010-12-31 |
| ISBN: | 978 0 580 64567 9 |
| Status: | Standard |
DESCRIPTION
BS EN 60191-6-21:2010
This standard BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices is classified in these ICS categories:
- 35.100.05 Multilayer applications
- 35.110 Networking
- 25.040.40 Industrial process measurement and control
- 31.080.01 Semiconductor devices in general
This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.