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Homepage>BS Standards>01 GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION>01.100 Technical drawings>01.100.25 Electrical and electronics engineering drawings>BS EN 60191-6-3:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)
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immediate downloadReleased: 2001-05-15
BS EN 60191-6-3:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

BS EN 60191-6-3:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

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Standard number:BS EN 60191-6-3:2001
Pages:20
Released:2001-05-15
ISBN:0 580 37243 X
Status:Standard
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BS EN 60191-6-3:2001


This standard BS EN 60191-6-3:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
  • 01.100.25 Electrical and electronics engineering drawings