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Homepage>BS Standards>01 GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION>01.100 Technical drawings>01.100.25 Electrical and electronics engineering drawings>BS EN 60191-6-6:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA)
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immediate downloadReleased: 2001-09-05
BS EN 60191-6-6:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA)

BS EN 60191-6-6:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA)

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Standard number:BS EN 60191-6-6:2001
Pages:16
Released:2001-09-05
ISBN:0 580 38393 8
Status:Standard
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BS EN 60191-6-6:2001


This standard BS EN 60191-6-6:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 01.100.25 Electrical and electronics engineering drawings
  • 31.080.01 Semiconductor devices in general
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.