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Homepage>BS Standards>01 GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION>01.100 Technical drawings>01.100.25 Electrical and electronics engineering drawings>BS EN 60191-6-8:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP)
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immediate downloadReleased: 2001-11-16
BS EN 60191-6-8:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP)

BS EN 60191-6-8:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP)

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Standard number:BS EN 60191-6-8:2001
Pages:14
Released:2001-11-16
ISBN:0 580 38677 5
Status:Standard
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BS EN 60191-6-8:2001


This standard BS EN 60191-6-8:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
  • 01.100.25 Electrical and electronics engineering drawings
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
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