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Homepage>BS Standards>31 ELECTRONICS>31.190 Electronic component assemblies>BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
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immediate downloadReleased: 2003-06-26
BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides

BS EN 61188-5-6:2003

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides

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Standard number:BS EN 61188-5-6:2003
Pages:22
Released:2003-06-26
ISBN:0 580 42110 4
Status:Standard
DESCRIPTION

BS EN 61188-5-6:2003


This standard BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations is classified in these ICS categories:
  • 31.190 Electronic component assemblies
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
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