PRICES include / exclude VAT

Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies

BS EN 61189-5-3:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies

English Secure PDF

Immediate download

331.20 EUR

You can read the standard for 1 hour. More information in the category: E-reading

Reading the standard

for 1 hour

33.12 EUR

You can read the standard for 24 hours. More information in the category: E-reading

Reading the standard

for 24 hours

99.36 EUR

English Hardcopy

In stock

331.20 EUR

Standard number:	BS EN 61189-5-3:2015
Pages:	46
Released:	2015-04-30
ISBN:	978 0 580 90019 8
Status:	Standard

DESCRIPTION

BS EN 61189-5-3:2015

This standard BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:

31.180 Printed circuits and boards

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

Print RECOMMEND