BS EN 61190-1-2:2014

Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly

English Secure PDF

Immediate download

266.20 EUR

You can read the standard for 1 hour. More information in the category: E-reading

Reading the standard

for 1 hour

26.62 EUR

You can read the standard for 24 hours. More information in the category: E-reading

Reading the standard

for 24 hours

79.86 EUR

English Hardcopy

In stock

266.20 EUR

Standard number:	BS EN 61190-1-2:2014
Pages:	26
Released:	2014-06-30
ISBN:	978 0 580 77840 7
Status:	Standard

DESCRIPTION

BS EN 61190-1-2:2014

This standard BS EN 61190-1-2:2014 Attachment materials for electronic assembly is classified in these ICS categories:

31.190 Electronic component assemblies

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.

Print RECOMMEND