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Homepage>BS Standards>31 ELECTRONICS>31.190 Electronic component assemblies>BS EN 61191-2:2017 Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
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immediate downloadReleased: 2019-10-07
BS EN 61191-2:2017 Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies

BS EN 61191-2:2017

Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies

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Standard number:BS EN 61191-2:2017
Pages:40
Released:2019-10-07
ISBN:978 0 539 06624 1
Status:Standard
DESCRIPTION

BS EN 61191-2:2017


This standard BS EN 61191-2:2017 Printed board assemblies is classified in these ICS categories:
  • 31.190 Electronic component assemblies
  • 31.240 Mechanical structures for electronic equipment

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through- hole, chip mounting, terminal mounting, etc.).