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immediate downloadReleased: 2017-09-25
BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
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| Standard number: | BS EN 61191-3:2017 |
| Pages: | 26 |
| Released: | 2017-09-25 |
| ISBN: | 978 0 580 91722 6 |
| Status: | Standard |
DESCRIPTION
BS EN 61191-3:2017
This standard BS EN 61191-3:2017 Printed board assemblies is classified in these ICS categories:
- 31.240 Mechanical structures for electronic equipment
- 31.180 Printed circuits and boards
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).