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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
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immediate downloadReleased: 2008-07-31
BS EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability

BS EN 61249-4-1:2008

Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability

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Standard number:BS EN 61249-4-1:2008
Pages:16
Released:2008-07-31
ISBN:978 0 580 53315 0
Status:Standard
DESCRIPTION

BS EN 61249-4-1:2008


This standard BS EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 31.180 Printed circuits and boards
IEC 61249-4-1:2008 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing multilayer boards in line with IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After lamination according to the supplier's instructions, the glass transition temperature is defined as being 120 °C minimum.
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