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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
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immediate downloadReleased: 2006-02-01
BS EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability

BS EN 61249-4-5:2005

Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability

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Standard number:BS EN 61249-4-5:2005
Pages:16
Released:2006-02-01
ISBN:0 580 47350 3
Status:Standard
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BS EN 61249-4-5:2005


This standard BS EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-8 when manufacturing multilayer boards according to IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined as 150 °C minimum.
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