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immediate downloadReleased: 2011-09-30
BS EN 62047-10:2011
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
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| Standard number: | BS EN 62047-10:2011 |
| Pages: | 18 |
| Released: | 2011-09-30 |
| ISBN: | 978 0 580 69447 9 |
| Status: | Standard |
DESCRIPTION
BS EN 62047-10:2011
This standard BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
- 31.080.99 Other semiconductor devices
This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.