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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.99 Other semiconductor devices>BS EN 62047-6:2010 Semiconductor devices. Micro-electromechanical devices Axial fatigue testing methods of thin film materials
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immediate downloadReleased: 2010-04-30
BS EN 62047-6:2010 Semiconductor devices. Micro-electromechanical devices Axial fatigue testing methods of thin film materials

BS EN 62047-6:2010

Semiconductor devices. Micro-electromechanical devices Axial fatigue testing methods of thin film materials

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Standard number:BS EN 62047-6:2010
Pages:20
Released:2010-04-30
ISBN:978 0 580 58544 9
Status:Standard
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BS EN 62047-6:2010


This standard BS EN 62047-6:2010 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices

This International Standard specifies the method for axial tensile–tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines.

The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.