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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.99 Other semiconductor devices>BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
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immediate downloadReleased: 2013-01-31
BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS

BS EN 62047-9:2011

Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS

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Standard number:BS EN 62047-9:2011
Pages:30
Released:2013-01-31
ISBN:978 0 580 78793 5
Status:Standard
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BS EN 62047-9:2011


This standard BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices

This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 µm to several millimeters.