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Homepage>BS Standards>31 ELECTRONICS>31.190 Electronic component assemblies>BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
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immediate downloadReleased: 2007-10-31
BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test

BS EN 62137-1-1:2007

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test

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Standard number:BS EN 62137-1-1:2007
Pages:18
Released:2007-10-31
ISBN:978 0 580 55335 6
Status:Standard
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BS EN 62137-1-1:2007


This standard BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint is classified in these ICS categories:
  • 31.190 Electronic component assemblies
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
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