Log inSign up
LANGUAGE en
Menu
STOREE-ReadingHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
Homepage>BS Standards>31 ELECTRONICS>31.190 Electronic component assemblies>BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Sponsored link
immediate downloadReleased: 2009-03-31
BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test

BS EN 62137-1-3:2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test

Format
Availability
Price and currency
English Secure PDF
Immediate download
249.60 EUR
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standard
for 1 hour
24.96 EUR
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standard
for 24 hours
74.88 EUR
English Hardcopy
In stock
249.60 EUR
Standard number:BS EN 62137-1-3:2009
Pages:28
Released:2009-03-31
ISBN:978 0 580 57386 6
Status:Standard
DESCRIPTION

BS EN 62137-1-3:2009


This standard BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint is classified in these ICS categories:
  • 31.190 Electronic component assemblies
The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
Print