BS EN 62137-3:2012

Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints

English Secure PDF

Immediate download

331.20 EUR

You can read the standard for 1 hour. More information in the category: E-reading

Reading the standard

for 1 hour

33.12 EUR

You can read the standard for 24 hours. More information in the category: E-reading

Reading the standard

for 24 hours

99.36 EUR

English Hardcopy

In stock

331.20 EUR

Standard number:	BS EN 62137-3:2012
Pages:	47
Released:	2012-03-31
ISBN:	978 0 580 68370 1
Status:	Standard

DESCRIPTION

BS EN 62137-3:2012

This standard BS EN 62137-3:2012 Electronics assembly technology is classified in these ICS categories:

31.190 Electronic component assemblies

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.

Print RECOMMEND