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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN 62418:2010 Semiconductor devices. Metallization stress void test
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immediate downloadReleased: 2010-08-31
BS EN 62418:2010 Semiconductor devices. Metallization stress void test

BS EN 62418:2010

Semiconductor devices. Metallization stress void test

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Standard number:BS EN 62418:2010
Pages:20
Released:2010-08-31
ISBN:978 0 580 62610 4
Status:Standard
DESCRIPTION

BS EN 62418:2010


This standard BS EN 62418:2010 Semiconductor devices. Metallization stress void test is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
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