BS EN IEC 60068-2-20:2021
Environmental testing Tests. Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
| Standard number: | BS EN IEC 60068-2-20:2021 |
| Pages: | 28 |
| Released: | 2021-05-13 |
| ISBN: | 978 0 580 51128 8 |
| Status: | Standard |
BS EN IEC 60068-2-20:2021 Environmental Testing Standard
Introducing the BS EN IEC 60068-2-20:2021, a comprehensive standard that provides essential test methods for evaluating the solderability and resistance to soldering heat of devices with leads. Released on May 13, 2021, this standard is a critical resource for professionals in the electronics and manufacturing industries who are committed to ensuring the reliability and durability of their products.
Overview of the Standard
The BS EN IEC 60068-2-20:2021 standard is part of the IEC 60068 series, which is dedicated to environmental testing. This particular document focuses on two key tests: Test Ta and Test Tb. These tests are designed to assess the solderability and the resistance to soldering heat of electronic devices with leads, which are crucial factors in maintaining the integrity and performance of electronic components.
Key Features
- Standard Number: BS EN IEC 60068-2-20:2021
- Pages: 28
- Release Date: 2021-05-13
- ISBN: 978 0 580 51128 8
- Status: Standard
Detailed Test Methods
The standard provides detailed methodologies for conducting Test Ta and Test Tb, ensuring that devices with leads can withstand the rigors of soldering processes. These tests are vital for preventing failures in electronic assemblies, which can lead to costly repairs and downtime.
Test Ta: Solderability
Test Ta focuses on the solderability of devices with leads. This test evaluates the ability of the device's leads to be wetted by solder, which is a critical factor in forming reliable solder joints. Proper solderability ensures that the electronic components can be securely attached to printed circuit boards (PCBs), providing stable electrical connections.
Test Tb: Resistance to Soldering Heat
Test Tb assesses the resistance of devices with leads to the heat generated during soldering processes. This test is crucial for determining whether the device can withstand the thermal stresses without degradation or failure. Ensuring resistance to soldering heat is essential for maintaining the functionality and longevity of electronic components.
Benefits of Compliance
Adhering to the BS EN IEC 60068-2-20:2021 standard offers numerous benefits for manufacturers and engineers:
- Enhanced Reliability: By ensuring solderability and resistance to soldering heat, products are less likely to experience failures, leading to increased reliability and customer satisfaction.
- Cost Efficiency: Reducing the risk of component failure minimizes the need for repairs and replacements, saving time and resources.
- Quality Assurance: Compliance with this standard demonstrates a commitment to quality and excellence, enhancing the reputation of your products and brand.
Who Should Use This Standard?
The BS EN IEC 60068-2-20:2021 standard is an invaluable resource for a wide range of professionals, including:
- Electronics Manufacturers: Ensure that your components meet industry standards for solderability and heat resistance.
- Quality Assurance Teams: Use the standard to verify the reliability and durability of electronic assemblies.
- Design Engineers: Incorporate the standard's guidelines into the design and testing phases to enhance product performance.
Conclusion
The BS EN IEC 60068-2-20:2021 standard is an essential tool for anyone involved in the design, manufacturing, and testing of electronic devices with leads. By following the test methods outlined in this standard, you can ensure that your products meet the highest standards of quality and reliability. Invest in this standard to safeguard your products against the challenges of soldering processes and to maintain a competitive edge in the electronics industry.
BS EN IEC 60068-2-20:2021
This standard BS EN IEC 60068-2-20:2021 Environmental testing is classified in these ICS categories:
- 31.040.10 Fixed resistors
- 19.040 Environmental testing
IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068?2?58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. This edition includes the following significant technical changes with respect to the previous edition: - update of and clarification of pre-conditioning (former "aging") and its relation to natural aging.