BS EN IEC 60747-15:2024 - Semiconductor Devices: Discrete Devices and Isolated Power Semiconductor Devices

Welcome to the future of semiconductor technology with the BS EN IEC 60747-15:2024 standard. This comprehensive document is a must-have for professionals in the field of electronics and semiconductor devices, providing the latest guidelines and specifications for discrete devices and isolated power semiconductor devices.

Overview

The BS EN IEC 60747-15:2024 standard is an essential resource for engineers, designers, and manufacturers involved in the development and application of semiconductor devices. Released on December 3, 2024, this standard is the latest in a series of updates that ensure compliance with international norms and enhance the performance and reliability of semiconductor components.

Key Features

• Standard Number: BS EN IEC 60747-15:2024
• Pages: 64
• ISBN: 978 0 539 21167 2
• Status: Standard

Why Choose BS EN IEC 60747-15:2024?

This standard is designed to provide a comprehensive framework for the design, testing, and application of discrete semiconductor devices. It covers a wide range of topics, including:

• Specifications for isolated power semiconductor devices
• Guidelines for ensuring device reliability and performance
• Testing methods to validate device functionality
• Design considerations for optimal device integration

Benefits of Compliance

Adhering to the BS EN IEC 60747-15:2024 standard offers numerous benefits, including:

• Enhanced Device Performance: By following the guidelines set forth in this standard, manufacturers can ensure that their devices operate at peak efficiency and reliability.
• Global Recognition: Compliance with international standards like BS EN IEC 60747-15:2024 ensures that your products are recognized and accepted worldwide, facilitating easier market entry and expansion.
• Improved Safety: The standard includes safety protocols that help prevent device failures and ensure the protection of end-users.
• Cost Efficiency: By adhering to standardized testing and design practices, companies can reduce development costs and minimize the risk of costly recalls or redesigns.

Who Should Use This Standard?

The BS EN IEC 60747-15:2024 standard is ideal for a wide range of professionals, including:

• Semiconductor device manufacturers
• Electronics engineers and designers
• Quality assurance and testing professionals
• Research and development teams

Stay Ahead with the Latest in Semiconductor Technology

In the rapidly evolving world of electronics, staying up-to-date with the latest standards is crucial. The BS EN IEC 60747-15:2024 standard provides the knowledge and guidelines necessary to keep your products at the forefront of technology. Whether you're developing new devices or improving existing ones, this standard is an invaluable tool for ensuring success in the competitive semiconductor market.

Conclusion

Invest in the future of your semiconductor devices with the BS EN IEC 60747-15:2024 standard. With its comprehensive coverage and up-to-date guidelines, this document is an essential resource for anyone involved in the design, manufacture, or application of discrete and isolated power semiconductor devices. Ensure your products meet the highest standards of performance, reliability, and safety by incorporating the principles outlined in this standard.

BS EN IEC 60747-15:2024

This standard BS EN IEC 60747-15:2024 Semiconductor devices is classified in these ICS categories:

• 27.160 Solar energy engineering
• 31.080.99 Other semiconductor devices

IEC 60747-15:2024 gives the requirements for isolated power semiconductor devices. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices and parts of IEC 60748 for ICs. This third edition includes the following significant technical changes with respect to the previous edition: a) The intelligent power semiconductor modules (IPM), which was previously excluded from the first and second edition, is now included in this document (Annex C); b) The thermal resistance is described for each switch (6.2.4); c) Added isolation test between temperature sensor and terminals, in case there is an agreement with the user (6.1.2).