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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN IEC 60749-10:2022 Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
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BS EN IEC 60749-10:2022 Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly

BS EN IEC 60749-10:2022

Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly

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Standard number:BS EN IEC 60749-10:2022
Pages:16
Released:2022-08-16
ISBN:978 0 539 17345 1
Status:Standard
BS EN IEC 60749-10:2022 Semiconductor Devices - Mechanical and Climatic Test Methods

BS EN IEC 60749-10:2022 Semiconductor Devices - Mechanical and Climatic Test Methods

Standard Number: BS EN IEC 60749-10:2022

Pages: 16

Released: 2022-08-16

ISBN: 978 0 539 17345 1

Name: Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly

Status: Standard

Overview

The BS EN IEC 60749-10:2022 standard is an essential document for professionals in the semiconductor industry. This standard provides comprehensive guidelines and methodologies for conducting mechanical and climatic tests on semiconductor devices and subassemblies. Released on August 16, 2022, this 16-page document is a critical resource for ensuring the reliability and durability of semiconductor components under various mechanical shock conditions.

Key Features

  • Comprehensive Testing Methods: The standard outlines detailed procedures for mechanical shock testing, ensuring that semiconductor devices can withstand harsh environmental conditions.
  • Up-to-Date Information: Released in 2022, this standard incorporates the latest advancements and best practices in the field of semiconductor testing.
  • Global Relevance: As an IEC standard, it is recognized and utilized worldwide, making it a valuable resource for international projects and collaborations.
  • Detailed Guidelines: The document provides step-by-step instructions, making it easy for professionals to implement the testing methods accurately and efficiently.

Why Choose BS EN IEC 60749-10:2022?

In the rapidly evolving field of semiconductor technology, ensuring the reliability and durability of components is paramount. The BS EN IEC 60749-10:2022 standard is designed to help manufacturers and engineers achieve this goal by providing a robust framework for mechanical and climatic testing. By adhering to this standard, you can:

  • Enhance Product Reliability: Ensure that your semiconductor devices can withstand mechanical shocks and harsh environmental conditions, thereby increasing their reliability and lifespan.
  • Meet Industry Standards: Comply with international standards, which can enhance your credibility and marketability in the global market.
  • Improve Quality Control: Implement rigorous testing procedures to identify and address potential issues early in the development process, leading to higher quality products.

Who Should Use This Standard?

The BS EN IEC 60749-10:2022 standard is ideal for a wide range of professionals in the semiconductor industry, including:

  • Manufacturers: Ensure that your products meet the highest standards of reliability and durability.
  • Engineers: Implement best practices in mechanical and climatic testing to enhance product performance.
  • Quality Control Specialists: Utilize detailed testing methodologies to maintain high standards of quality and reliability.
  • Researchers: Stay up-to-date with the latest advancements and methodologies in semiconductor testing.

Detailed Content

The BS EN IEC 60749-10:2022 standard covers a wide range of topics related to mechanical and climatic testing of semiconductor devices, including:

  • Introduction: Overview of the standard and its objectives.
  • Scope: Detailed description of the types of semiconductor devices and subassemblies covered by the standard.
  • Testing Procedures: Step-by-step guidelines for conducting mechanical shock tests, including equipment requirements, test conditions, and evaluation criteria.
  • Data Analysis: Methods for analyzing and interpreting test results to ensure accurate and reliable conclusions.
  • Appendices: Additional resources and references to support the implementation of the standard.

Conclusion

The BS EN IEC 60749-10:2022 standard is an invaluable resource for anyone involved in the design, manufacturing, and testing of semiconductor devices. By providing comprehensive guidelines for mechanical and climatic testing, this standard helps ensure the reliability and durability of semiconductor components, ultimately leading to higher quality products and greater customer satisfaction. Whether you are a manufacturer, engineer, quality control specialist, or researcher, this standard is an essential tool for achieving excellence in the semiconductor industry.

DESCRIPTION

BS EN IEC 60749-10:2022


This standard BS EN IEC 60749-10:2022 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:
  1. covers both unattached components and components attached to printed wiring boards;
  2. tolerance limits modified for peak acceleration and pulse duration;
  3. mathematical formulae added for velocity change and equivalent drop height.