BS EN IEC 60749-15:2020
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
| Standard number: | BS EN IEC 60749-15:2020 |
| Pages: | 16 |
| Released: | 2020-10-01 |
| ISBN: | 978 0 539 04937 4 |
| Status: | Standard |
BS EN IEC 60749-15:2020: Semiconductor Devices - Mechanical and Climatic Test Methods
Introducing the BS EN IEC 60749-15:2020, a comprehensive standard that provides essential guidelines for testing the resistance to soldering temperature of through-hole mounted semiconductor devices. This standard is a critical resource for professionals in the semiconductor industry, ensuring that devices meet rigorous mechanical and climatic test requirements.
Overview
The BS EN IEC 60749-15:2020 standard is an authoritative document that outlines the procedures and methods for assessing the resistance of semiconductor devices to soldering temperatures. This is particularly crucial for through-hole mounted devices, which are commonly used in various electronic applications. The standard ensures that these devices can withstand the thermal stresses encountered during the soldering process, thereby maintaining their reliability and performance.
Key Features
- Standard Number: BS EN IEC 60749-15:2020
- Pages: 16
- Released: 2020-10-01
- ISBN: 978 0 539 04937 4
- Status: Standard
Importance of the Standard
In the fast-evolving world of electronics, ensuring the durability and reliability of semiconductor devices is paramount. The BS EN IEC 60749-15:2020 standard plays a vital role in this regard by providing a structured approach to testing. By adhering to this standard, manufacturers can guarantee that their products are capable of withstanding the high temperatures associated with soldering, which is a common process in the assembly of electronic circuits.
This standard is particularly beneficial for:
- Manufacturers: Ensures that products meet international quality and safety standards.
- Quality Assurance Teams: Provides a benchmark for testing and validating product durability.
- Design Engineers: Offers insights into the thermal limits of materials and components used in device construction.
Detailed Content
The BS EN IEC 60749-15:2020 standard is meticulously structured to cover all aspects of testing semiconductor devices for resistance to soldering temperatures. It includes detailed methodologies, test conditions, and acceptance criteria, ensuring comprehensive coverage of the subject matter. The document spans 16 pages, providing in-depth information that is crucial for professionals involved in the design, manufacturing, and testing of semiconductor devices.
Why Choose This Standard?
Choosing the BS EN IEC 60749-15:2020 standard means opting for a document that is recognized globally for its precision and reliability. It is part of the IEC 60749 series, which is widely respected in the industry for setting the benchmark in semiconductor testing. By implementing this standard, organizations can enhance their product quality, reduce failure rates, and improve customer satisfaction.
Conclusion
In conclusion, the BS EN IEC 60749-15:2020 standard is an indispensable tool for anyone involved in the semiconductor industry. Its comprehensive guidelines ensure that through-hole mounted devices can withstand the rigors of soldering, thereby enhancing their performance and longevity. Whether you are a manufacturer, quality assurance professional, or design engineer, this standard provides the necessary framework to achieve excellence in semiconductor device production.
Invest in the BS EN IEC 60749-15:2020 standard today and ensure that your semiconductor devices meet the highest standards of quality and reliability.
BS EN IEC 60749-15:2020
This standard BS EN IEC 60749-15:2020 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
- 31.080.01 Semiconductor devices in general
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3, Terms and definitions; - clarification of the use of a soldering iron for producing the heating effect; - inclusion an option to use accelerated ageing.