BS EN IEC 60749-28:2022: Semiconductor Devices - Mechanical and Climatic Test Methods for ESD Sensitivity Testing (CDM)

Standard Number: BS EN IEC 60749-28:2022

Pages: 54

Released: 2022-09-06

ISBN: 978 0 539 13657 9

Status: Standard

Overview

The BS EN IEC 60749-28:2022 standard is an essential document for professionals in the semiconductor industry. This comprehensive standard outlines the mechanical and climatic test methods for evaluating the electrostatic discharge (ESD) sensitivity of semiconductor devices using the Charged Device Model (CDM) at the device level. Released on September 6, 2022, this 54-page document is a critical resource for ensuring the reliability and durability of semiconductor components in various applications.

Key Features

• Comprehensive Testing Methods: The standard provides detailed procedures for conducting mechanical and climatic tests to assess the ESD sensitivity of semiconductor devices. These methods are designed to simulate real-world conditions and ensure the robustness of the devices.
• Charged Device Model (CDM): The CDM is a widely recognized model for ESD testing, and this standard focuses specifically on this model to provide accurate and reliable results.
• Device-Level Testing: The standard emphasizes testing at the device level, ensuring that individual components meet the required ESD sensitivity criteria before being integrated into larger systems.
• Up-to-Date Information: Released in 2022, this standard incorporates the latest advancements and best practices in ESD sensitivity testing, making it a valuable resource for current and future projects.

Why Choose BS EN IEC 60749-28:2022?

Electrostatic discharge (ESD) is a significant concern in the semiconductor industry, as it can cause immediate or latent damage to sensitive components. The BS EN IEC 60749-28:2022 standard provides a rigorous framework for testing and mitigating ESD risks, ensuring the longevity and performance of semiconductor devices. By adhering to this standard, manufacturers can:

• Enhance Product Reliability: Thorough ESD testing helps identify and address potential vulnerabilities, leading to more reliable and durable products.
• Reduce Failure Rates: By detecting and mitigating ESD sensitivity issues early in the development process, manufacturers can significantly reduce the risk of device failures in the field.
• Ensure Compliance: Meeting the requirements of this internationally recognized standard demonstrates a commitment to quality and compliance with industry best practices.
• Gain Competitive Advantage: Products that meet stringent ESD sensitivity criteria are more likely to be trusted by customers and preferred in the market.

Detailed Content

The BS EN IEC 60749-28:2022 standard is divided into several sections, each providing in-depth information on various aspects of ESD sensitivity testing:

• Introduction: An overview of the importance of ESD testing and the scope of the standard.
• Test Methods: Detailed descriptions of the mechanical and climatic test methods used to evaluate ESD sensitivity, including step-by-step procedures and required equipment.
• CDM Testing: Specific guidelines for conducting Charged Device Model (CDM) tests, including test setup, execution, and data interpretation.
• Device-Level Testing: Instructions for performing ESD sensitivity tests at the device level, ensuring that individual components meet the necessary criteria.
• Data Analysis and Reporting: Guidance on analyzing test results and reporting findings in a clear and consistent manner.
• Appendices: Additional resources and reference materials to support the implementation of the standard.

Who Should Use This Standard?

The BS EN IEC 60749-28:2022 standard is designed for a wide range of professionals in the semiconductor industry, including:

• Design Engineers: To ensure that new semiconductor designs meet ESD sensitivity requirements.
• Quality Assurance Teams: To implement rigorous testing protocols and verify compliance with industry standards.
• Manufacturers: To enhance product reliability and reduce the risk of ESD-related failures.
• Test Engineers: To conduct accurate and reliable ESD sensitivity tests using the CDM model.
• Compliance Officers: To ensure that products meet the necessary regulatory and industry standards.

Conclusion

The BS EN IEC 60749-28:2022 standard is an invaluable resource for anyone involved in the design, testing, and manufacturing of semiconductor devices. By providing comprehensive guidelines for ESD sensitivity testing using the Charged Device Model (CDM), this standard helps ensure the reliability, durability, and compliance of semiconductor components. Whether you are a design engineer, quality assurance professional, or manufacturer, adhering to this standard will help you produce high-quality products that meet the stringent demands of the modern electronics industry.

BS EN IEC 60749-28:2022

This standard BS EN IEC 60749-28:2022 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:

• 31.080.01 Semiconductor devices in general

IEC 60749-28:2022 is available as IEC 60749-28:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition: - a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages; - changes to clarify cleaning of devices and testers.