BS EN IEC 60749-30:2020 - Semiconductor Devices Standard

Welcome to the world of semiconductor devices, where precision, reliability, and innovation converge. Introducing the BS EN IEC 60749-30:2020, a comprehensive standard that sets the benchmark for mechanical and climatic test methods, specifically focusing on the preconditioning of non-hermetic surface mount devices prior to reliability testing.

Overview

The BS EN IEC 60749-30:2020 is an essential standard for professionals in the semiconductor industry. Released on September 30, 2020, this standard is a critical resource for ensuring the reliability and performance of semiconductor devices. With a total of 18 pages, it provides detailed guidelines and methodologies for preconditioning non-hermetic surface mount devices, preparing them for rigorous reliability testing.

Key Features

• Standard Number: BS EN IEC 60749-30:2020
• ISBN: 978 0 539 04583 3
• Status: Standard

Why Choose BS EN IEC 60749-30:2020?

In the fast-paced world of technology, ensuring the reliability of semiconductor devices is paramount. The BS EN IEC 60749-30:2020 standard provides a robust framework for preconditioning non-hermetic surface mount devices, which are crucial components in a wide range of electronic applications. By adhering to this standard, manufacturers and engineers can significantly enhance the durability and performance of their products.

Comprehensive Testing Methods

This standard outlines a series of mechanical and climatic test methods designed to simulate real-world conditions. These tests are essential for identifying potential weaknesses in semiconductor devices, allowing for improvements and optimizations before they reach the market. By following the guidelines set forth in this standard, you can ensure that your devices meet the highest quality and reliability standards.

Enhanced Reliability

Reliability is a key factor in the success of any electronic device. The preconditioning processes detailed in the BS EN IEC 60749-30:2020 standard are specifically designed to enhance the reliability of non-hermetic surface mount devices. By subjecting these devices to rigorous testing, manufacturers can identify and address potential issues, resulting in products that perform consistently and reliably over time.

Industry Compliance

Compliance with industry standards is crucial for maintaining a competitive edge in the semiconductor market. The BS EN IEC 60749-30:2020 standard is recognized globally, making it an essential resource for companies looking to expand their reach and ensure their products meet international quality benchmarks. By implementing the guidelines in this standard, you can demonstrate your commitment to excellence and gain the trust of customers and partners worldwide.

Who Should Use This Standard?

The BS EN IEC 60749-30:2020 standard is ideal for a wide range of professionals in the semiconductor industry, including:

• Semiconductor manufacturers
• Quality assurance engineers
• Product development teams
• Research and development specialists
• Compliance officers

Conclusion

In conclusion, the BS EN IEC 60749-30:2020 standard is an invaluable resource for anyone involved in the design, manufacture, and testing of semiconductor devices. By providing detailed guidelines for preconditioning non-hermetic surface mount devices, this standard helps ensure the reliability and performance of these critical components. Whether you're a manufacturer looking to enhance product quality or an engineer seeking to optimize device performance, this standard is an essential tool in your arsenal.

Embrace the future of semiconductor technology with the BS EN IEC 60749-30:2020 standard and ensure your products meet the highest standards of quality and reliability.

BS EN IEC 60749-30:2020

This standard BS EN IEC 60749-30:2020 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:

• 31.080.01 Semiconductor devices in general

This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.

The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.

These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).

NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore, the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to ensure that it does not exceed the temperature at which the components are evaluated.

NOTE 2 For the purpose of this document, SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials.