BS EN IEC 60749-39:2022
Semiconductor devices. Mechanical and climatic test methods Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
| Standard number: | BS EN IEC 60749-39:2022 |
| Pages: | 18 |
| Released: | 2022-03-07 |
| ISBN: | 978 0 539 15200 5 |
| Status: | Standard |
BS EN IEC 60749-39:2022: Semiconductor Devices - Mechanical and Climatic Test Methods
Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used for Semiconductor Components
Introducing the BS EN IEC 60749-39:2022, a comprehensive standard that sets the benchmark for the measurement of moisture diffusivity and water solubility in organic materials used in semiconductor components. Released on March 7, 2022, this standard is an essential resource for professionals in the semiconductor industry, ensuring the highest levels of quality and reliability in their products.
Key Features and Benefits
- Standard Number: BS EN IEC 60749-39:2022
- Pages: 18
- Release Date: 2022-03-07
- ISBN: 978 0 539 15200 5
- Status: Standard
This standard is meticulously designed to provide detailed methodologies for assessing the moisture diffusivity and water solubility of organic materials. These properties are critical in determining the performance and longevity of semiconductor components, especially in environments where moisture exposure is a concern.
Why This Standard is Essential
The semiconductor industry is constantly evolving, with new materials and technologies being developed to meet the demands of modern applications. The BS EN IEC 60749-39:2022 standard ensures that these materials are rigorously tested for moisture-related properties, which can significantly impact their performance. By adhering to this standard, manufacturers can guarantee that their products meet the highest quality and reliability standards.
Comprehensive Testing Methods
The standard outlines precise mechanical and climatic test methods, providing a clear framework for measuring moisture diffusivity and water solubility. These tests are crucial for identifying potential issues that could arise from moisture exposure, such as swelling, delamination, or degradation of the organic materials used in semiconductor components.
Who Should Use This Standard?
This standard is indispensable for:
- Semiconductor manufacturers
- Quality assurance professionals
- Materials scientists
- Research and development teams
- Regulatory bodies
Ensuring Product Reliability
By implementing the guidelines and test methods outlined in the BS EN IEC 60749-39:2022 standard, manufacturers can ensure that their semiconductor components are robust and reliable, even in challenging environmental conditions. This not only enhances the performance of the components but also extends their lifespan, providing greater value to end-users.
Stay Ahead of the Curve
In an industry where innovation is key, staying ahead of the curve is crucial. The BS EN IEC 60749-39:2022 standard equips professionals with the knowledge and tools needed to maintain a competitive edge. By adhering to this standard, companies can demonstrate their commitment to quality and reliability, fostering trust and confidence among their customers.
Conclusion
The BS EN IEC 60749-39:2022 standard is a vital resource for anyone involved in the semiconductor industry. Its detailed methodologies for measuring moisture diffusivity and water solubility in organic materials ensure that semiconductor components meet the highest standards of quality and reliability. By following this standard, professionals can enhance the performance and longevity of their products, ultimately delivering greater value to their customers.
Invest in the BS EN IEC 60749-39:2022 standard today and take a significant step towards ensuring the excellence of your semiconductor components.
BS EN IEC 60749-39:2022
This standard BS EN IEC 60749-39:2022 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
- 31.080.01 Semiconductor devices in general
IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition: - updated procedure for "dry weight" determination.