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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61188-6-1:2021 Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
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BS EN IEC 61188-6-1:2021 Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards

BS EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards

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Standard number:BS EN IEC 61188-6-1:2021
Pages:36
Released:2021-04-07
ISBN:978 0 580 99718 1
Status:Standard
BS EN IEC 61188-6-1:2021 - Circuit Boards and Circuit Board Assemblies

BS EN IEC 61188-6-1:2021 - Circuit Boards and Circuit Board Assemblies

Welcome to the comprehensive guide on the BS EN IEC 61188-6-1:2021 standard, a crucial document for professionals in the field of electronics and circuit board design. This standard provides essential guidelines and requirements for the design and use of land patterns on circuit boards, ensuring optimal performance and reliability in electronic assemblies.

Overview of the Standard

The BS EN IEC 61188-6-1:2021 standard is a pivotal resource for engineers and designers involved in the creation and assembly of circuit boards. Released on April 7, 2021, this document spans 36 pages and is identified by the ISBN 978 0 580 99718 1. It serves as a generic requirement guide for land pattern design, which is a critical aspect of circuit board functionality.

Key Features and Benefits

  • Comprehensive Guidelines: This standard provides detailed instructions on the design and use of land patterns, which are essential for ensuring the proper placement and soldering of components on circuit boards.
  • Enhanced Reliability: By adhering to the guidelines set forth in this standard, designers can significantly improve the reliability and performance of electronic assemblies.
  • Industry Compliance: Following this standard ensures compliance with international best practices, which is crucial for manufacturers and designers operating in global markets.
  • Up-to-Date Information: As a 2021 release, this standard incorporates the latest advancements and methodologies in circuit board design, making it a current and relevant resource.

Importance of Land Pattern Design

Land pattern design is a fundamental aspect of circuit board assembly. It involves the creation of specific patterns on the board where components will be placed and soldered. Proper land pattern design is crucial for several reasons:

  • Component Placement: Accurate land patterns ensure that components are placed correctly, which is vital for the functionality of the circuit.
  • Solder Joint Integrity: Well-designed land patterns contribute to strong solder joints, reducing the risk of component failure.
  • Thermal Management: Effective land pattern design can aid in heat dissipation, preventing overheating and extending the lifespan of the circuit board.

Who Should Use This Standard?

The BS EN IEC 61188-6-1:2021 standard is an invaluable resource for a wide range of professionals, including:

  • Electronic Engineers: Engineers involved in the design and development of electronic circuits will find this standard essential for creating reliable and efficient designs.
  • PCB Designers: Professionals responsible for designing printed circuit boards (PCBs) can use this standard to ensure their designs meet industry requirements.
  • Quality Assurance Teams: QA teams can utilize this standard to verify that circuit board designs comply with international standards, ensuring product quality and reliability.
  • Manufacturers: Companies involved in the production of electronic assemblies can benefit from this standard by ensuring their products meet global quality benchmarks.

Structure of the Standard

The document is structured to provide a logical flow of information, making it easy for users to find the specific guidelines and requirements they need. Key sections include:

  • Introduction: An overview of the standard's purpose and scope.
  • Design Guidelines: Detailed instructions on creating effective land patterns.
  • Compliance Requirements: Information on how to ensure designs meet international standards.
  • Appendices: Additional resources and references for further reading.

Conclusion

In the fast-evolving world of electronics, staying up-to-date with the latest standards is crucial for success. The BS EN IEC 61188-6-1:2021 standard is an essential tool for anyone involved in the design and assembly of circuit boards. By following the guidelines outlined in this document, professionals can ensure their designs are not only compliant with international standards but also optimized for performance and reliability.

Whether you are an engineer, designer, or manufacturer, this standard provides the knowledge and guidance needed to excel in the competitive field of electronics. Embrace the best practices outlined in this standard and take your circuit board designs to the next level.

DESCRIPTION

BS EN IEC 61188-6-1:2021


This standard BS EN IEC 61188-6-1:2021 Circuit boards and circuit board assemblies. Design and use is classified in these ICS categories:
  • 31.190 Electronic component assemblies
  • 31.180 Printed circuits and boards
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.