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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61188-6-2:2021 Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
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immediate downloadReleased: 2021-03-19
BS EN IEC 61188-6-2:2021 Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

BS EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

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Standard number:BS EN IEC 61188-6-2:2021
Pages:32
Released:2021-03-19
ISBN:978 0 539 05928 1
Status:Standard
BS EN IEC 61188-6-2:2021 - Circuit Boards and Circuit Board Assemblies

BS EN IEC 61188-6-2:2021 - Circuit Boards and Circuit Board Assemblies

Welcome to the comprehensive guide on the BS EN IEC 61188-6-2:2021 standard, a crucial document for professionals in the electronics industry. This standard provides detailed guidelines on the design and use of land patterns for the most common surface-mounted components (SMD), ensuring optimal performance and reliability in circuit board assemblies.

Overview of the Standard

The BS EN IEC 61188-6-2:2021 standard is an essential resource for engineers and designers involved in the creation of circuit boards and assemblies. Released on March 19, 2021, this document spans 32 pages and is identified by the ISBN 978 0 539 05928 1. It is a recognized standard that provides a comprehensive description of land pattern designs, which are critical for the effective placement and soldering of SMD components.

Key Features and Benefits

  • Comprehensive Guidelines: This standard offers detailed instructions on designing land patterns, which are crucial for ensuring the proper alignment and soldering of SMD components on circuit boards.
  • Industry Standard: As a recognized standard, it provides a reliable reference for professionals, ensuring consistency and quality in circuit board design and assembly.
  • Enhanced Performance: By following the guidelines outlined in this standard, designers can optimize the performance and reliability of their circuit board assemblies.
  • Up-to-Date Information: Released in 2021, this standard reflects the latest advancements and best practices in the field of electronics design.

Why Choose BS EN IEC 61188-6-2:2021?

In the fast-paced world of electronics, staying ahead of the curve is essential. The BS EN IEC 61188-6-2:2021 standard equips professionals with the knowledge and tools needed to design and implement effective land patterns for SMD components. By adhering to this standard, you can ensure that your circuit board assemblies meet the highest quality and performance standards.

Design and Use of Land Patterns

Land patterns are the foundation of any successful circuit board design. They determine the placement and soldering of components, directly impacting the board's functionality and reliability. This standard provides a detailed description of land patterns for the most common SMD components, offering guidance on dimensions, tolerances, and layout considerations.

Ensuring Quality and Consistency

Consistency is key in circuit board design and assembly. By following the guidelines set forth in the BS EN IEC 61188-6-2:2021 standard, you can ensure that your designs are consistent with industry best practices. This not only enhances the quality of your products but also reduces the risk of errors and rework, saving time and resources.

Who Should Use This Standard?

This standard is an invaluable resource for a wide range of professionals in the electronics industry, including:

  • Electronics Engineers: Gain insights into the latest design practices for SMD components, ensuring optimal performance and reliability.
  • PCB Designers: Access detailed guidelines on land pattern design, helping you create efficient and effective circuit board layouts.
  • Quality Assurance Professionals: Ensure that your products meet industry standards and deliver consistent quality to your customers.
  • Manufacturers: Streamline your production processes by adhering to standardized design practices, reducing errors and improving efficiency.

Conclusion

The BS EN IEC 61188-6-2:2021 standard is an essential tool for anyone involved in the design and assembly of circuit boards. By providing comprehensive guidelines on land pattern design for SMD components, it ensures that your products meet the highest standards of quality and performance. Whether you're an engineer, designer, or manufacturer, this standard will help you stay at the forefront of the electronics industry.

Invest in the BS EN IEC 61188-6-2:2021 standard today and take your circuit board designs to the next level. With its detailed guidance and industry recognition, it's the perfect resource for ensuring the success of your electronic products.

DESCRIPTION

BS EN IEC 61188-6-2:2021


This standard BS EN IEC 61188-6-2:2021 Circuit boards and circuit board assemblies. Design and use is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.