BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Standard number: | BS EN IEC 61188-6-4:2019 |
Pages: | 46 |
Released: | 2019-07-12 |
ISBN: | 978 0 580 96642 2 |
Status: | Standard |
BS EN IEC 61188-6-4:2019: A Comprehensive Guide to Printed Boards and Assemblies
In the ever-evolving world of electronics, precision and reliability are paramount. The BS EN IEC 61188-6-4:2019 standard is an essential resource for professionals involved in the design and use of printed boards and printed board assemblies. This standard provides generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design, ensuring that your designs meet the highest industry standards.
Key Features of the Standard
The BS EN IEC 61188-6-4:2019 standard is a comprehensive document that spans 46 pages, offering detailed guidance and specifications. Released on July 12, 2019, this standard is the latest in a series of updates that reflect the current best practices in the industry. With an ISBN of 978 0 580 96642 2, it is easily identifiable and accessible for professionals seeking to enhance their design processes.
Why This Standard is Essential
As technology advances, the demand for smaller, more efficient electronic components increases. Surface mounted components (SMD) are at the forefront of this trend, offering compact and efficient solutions for modern electronic devices. However, designing these components requires precision and adherence to specific guidelines to ensure functionality and reliability.
The BS EN IEC 61188-6-4:2019 standard provides a framework for creating accurate dimensional drawings of SMDs. By following these guidelines, designers can ensure that their land patterns are optimized for performance, reducing the risk of errors and improving the overall quality of the final product.
Comprehensive Coverage
This standard covers a wide range of topics related to land pattern design, including:
- Generic requirements for dimensional drawings of SMDs
- Best practices for land pattern design
- Guidelines for ensuring compatibility with various manufacturing processes
- Strategies for minimizing errors and improving reliability
By adhering to these guidelines, professionals can ensure that their designs are not only compliant with industry standards but also optimized for performance and reliability.
Who Should Use This Standard?
The BS EN IEC 61188-6-4:2019 standard is an invaluable resource for a wide range of professionals, including:
- Electronic design engineers
- PCB designers
- Manufacturing engineers
- Quality assurance professionals
Whether you are designing new products or improving existing ones, this standard provides the guidance you need to ensure that your designs meet the highest standards of quality and reliability.
Stay Ahead with the Latest Standards
In the fast-paced world of electronics, staying up-to-date with the latest standards is crucial. The BS EN IEC 61188-6-4:2019 standard represents the cutting edge of land pattern design, providing the tools and knowledge you need to stay ahead of the competition.
By incorporating the guidelines and best practices outlined in this standard, you can enhance your design processes, improve product quality, and ensure compliance with industry regulations. Whether you are a seasoned professional or new to the field, this standard is an essential addition to your professional library.
Conclusion
The BS EN IEC 61188-6-4:2019 standard is more than just a set of guidelines; it is a comprehensive resource that empowers professionals to create high-quality, reliable electronic components. With its detailed coverage of land pattern design and dimensional drawings, this standard is an indispensable tool for anyone involved in the design and manufacture of printed boards and assemblies.
Invest in your professional development and ensure the success of your projects by incorporating the BS EN IEC 61188-6-4:2019 standard into your workflow. With its clear guidelines and best practices, you can achieve excellence in your designs and stay at the forefront of the electronics industry.
BS EN IEC 61188-6-4:2019
This standard BS EN IEC 61188-6-4:2019 Printed boards and printed board assemblies. Design and use is classified in these ICS categories:
- 31.190 Electronic component assemblies
- 31.180 Printed circuits and boards
- 13.120 Domestic safety
- 97.040.20 Cooking ranges, working tables, ovens and similar appliances
This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series.
This document is applicable to the SMD of semiconductor devices and electrical components.