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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
immediate downloadReleased: 2023-12-25
BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials

BS EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials

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Standard number:BS EN IEC 61189-2-801:2023
Pages:16
Released:2023-12-25
ISBN:978 0 539 28571 0
Status:Standard

BS EN IEC 61189-2-801:2023 - Test Methods for Electrical Materials, Printed Boards, and Other Interconnection Structures and Assemblies: Thermal Conductivity Test for Base Materials

Introducing the latest standard in the field of electrical materials and printed boards, the BS EN IEC 61189-2-801:2023. This comprehensive document provides detailed test methods for evaluating the thermal conductivity of base materials used in electrical components, printed boards, and other interconnection structures and assemblies. Released on December 25, 2023, this standard is an essential resource for professionals in the electronics and electrical engineering industries.

Key Features and Benefits

The BS EN IEC 61189-2-801:2023 standard is meticulously designed to ensure that you have the most accurate and reliable methods for testing the thermal conductivity of base materials. Here are some of the key features and benefits:

  • Comprehensive Coverage: This standard covers a wide range of materials and structures, ensuring that you have the necessary guidelines for various applications.
  • Precision and Accuracy: The test methods outlined in this standard are designed to provide precise and accurate measurements, ensuring the reliability of your results.
  • Up-to-Date Information: Released in December 2023, this standard includes the latest advancements and updates in the field, keeping you ahead of the curve.
  • International Recognition: As a part of the IEC (International Electrotechnical Commission) standards, this document is recognized and respected globally, ensuring compliance with international norms.

Technical Specifications

Here are the technical specifications of the BS EN IEC 61189-2-801:2023 standard:

  • Standard Number: BS EN IEC 61189-2-801:2023
  • Pages: 16
  • Release Date: December 25, 2023
  • ISBN: 978 0 539 28571 0
  • Name: Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
  • Status: Standard

Why Thermal Conductivity Testing is Crucial

Thermal conductivity testing is a critical aspect of evaluating the performance and reliability of electrical materials and printed boards. Here’s why it’s so important:

  • Heat Management: Effective heat management is crucial for the longevity and performance of electronic components. High thermal conductivity materials can efficiently dissipate heat, preventing overheating and potential damage.
  • Performance Optimization: Understanding the thermal properties of materials allows engineers to optimize the performance of electronic devices, ensuring they operate within safe temperature ranges.
  • Reliability and Safety: Accurate thermal conductivity measurements help in assessing the reliability and safety of electronic assemblies, reducing the risk of failures and ensuring compliance with safety standards.

Who Should Use This Standard?

The BS EN IEC 61189-2-801:2023 standard is an invaluable resource for a wide range of professionals, including:

  • Electrical Engineers: Engineers involved in the design and development of electronic components and systems will find this standard essential for ensuring the thermal performance of their designs.
  • Quality Assurance Professionals: QA teams can use the test methods outlined in this standard to verify the thermal properties of materials, ensuring they meet the required specifications.
  • Manufacturers: Companies involved in the production of printed boards and other interconnection structures can use this standard to ensure their products meet international quality and performance standards.
  • Researchers and Academics: Researchers studying the thermal properties of materials will find the detailed test methods in this standard invaluable for their work.

How to Implement This Standard

Implementing the BS EN IEC 61189-2-801:2023 standard in your organization involves several key steps:

  1. Acquire the Standard: Ensure you have the latest version of the standard, released on December 25, 2023.
  2. Train Your Team: Provide training to your engineering and QA teams on the test methods and procedures outlined in the standard.
  3. Set Up Testing Facilities: Ensure you have the necessary equipment and facilities to conduct the thermal conductivity tests as per the standard.
  4. Conduct Regular Testing: Implement a regular testing schedule to continuously monitor the thermal properties of your materials and assemblies.
  5. Document and Review: Keep detailed records of all test results and regularly review them to ensure compliance with the standard.

Conclusion

The BS EN IEC 61189-2-801:2023 standard is an essential tool for anyone involved in the design, production, and quality assurance of electrical materials and printed boards. With its comprehensive test methods and up-to-date information, this standard ensures that you can accurately assess the thermal conductivity of your materials, leading to better performance, reliability, and safety of your electronic assemblies.

Stay ahead in the competitive field of electronics by implementing the BS EN IEC 61189-2-801:2023 standard in your organization. Ensure your products meet the highest international standards and deliver exceptional performance to your customers.

DESCRIPTION

BS EN IEC 61189-2-801:2023


This standard BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.