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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-805:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA
immediate downloadReleased: 2024-05-30
BS EN IEC 61189-2-805:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA

BS EN IEC 61189-2-805:2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA

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Standard number:BS EN IEC 61189-2-805:2024
Pages:14
Released:2024-05-30
ISBN:978 0 539 16464 0
Status:Standard
BS EN IEC 61189-2-805:2024 - Test Methods for Electrical Materials

BS EN IEC 61189-2-805:2024

Test Methods for Electrical Materials, Printed Boards, and Other Interconnection Structures and Assemblies X/Y CTE Test for Thin Base Materials by TMA

Standard Number: BS EN IEC 61189-2-805:2024

Pages: 14

Released: 2024-05-30

ISBN: 978 0 539 16464 0

Status: Standard

Overview

The BS EN IEC 61189-2-805:2024 standard is an essential resource for professionals in the field of electrical materials, printed boards, and interconnection structures. This comprehensive document provides detailed test methods for evaluating the X/Y Coefficient of Thermal Expansion (CTE) of thin base materials using Thermomechanical Analysis (TMA). Released on May 30, 2024, this 14-page standard is a must-have for ensuring the reliability and performance of your electrical components.

Why Choose BS EN IEC 61189-2-805:2024?

In the rapidly evolving world of electronics, ensuring the quality and reliability of materials is paramount. The BS EN IEC 61189-2-805:2024 standard offers a rigorous and precise methodology for testing the X/Y CTE of thin base materials. This is crucial for applications where thermal stability and material integrity are critical.

Key Features:

  • Comprehensive Testing Methods: Detailed procedures for conducting X/Y CTE tests using TMA, ensuring accurate and reliable results.
  • Industry Standard: Adheres to the latest industry standards, providing confidence in the quality and consistency of your materials.
  • Expert Guidance: Developed by leading experts in the field, offering insights and best practices for optimal testing.
  • Up-to-Date Information: Released in 2024, this standard reflects the most current advancements and methodologies in the industry.

Applications

The BS EN IEC 61189-2-805:2024 standard is applicable across a wide range of industries and applications, including:

  • Electronics Manufacturing: Ensuring the reliability and performance of printed circuit boards (PCBs) and other interconnection structures.
  • Material Science: Evaluating the thermal properties of new and existing materials for use in various electronic applications.
  • Quality Assurance: Providing a standardized method for testing and verifying the thermal stability of materials, crucial for maintaining high-quality standards.
  • Research and Development: Supporting the development of new materials and technologies with precise and reliable testing methods.

Benefits

By adopting the BS EN IEC 61189-2-805:2024 standard, you can expect numerous benefits, including:

  • Enhanced Reliability: Ensure the thermal stability and integrity of your materials, reducing the risk of failure in critical applications.
  • Improved Performance: Optimize the performance of your electronic components by selecting materials with proven thermal properties.
  • Cost Savings: Minimize the risk of material failure and associated costs by adhering to standardized testing methods.
  • Regulatory Compliance: Meet industry regulations and standards, ensuring your products are market-ready and compliant.

Detailed Content

The BS EN IEC 61189-2-805:2024 standard is meticulously structured to provide clear and concise guidance on testing methods. The document includes:

  • Introduction: An overview of the importance of X/Y CTE testing and its applications in the industry.
  • Scope: Defines the range of materials and applications covered by the standard.
  • Test Methods: Step-by-step procedures for conducting X/Y CTE tests using TMA, including equipment requirements, sample preparation, and testing conditions.
  • Data Analysis: Guidelines for interpreting test results and assessing material performance.
  • References: A comprehensive list of related standards and publications for further reading.

Who Should Use This Standard?

The BS EN IEC 61189-2-805:2024 standard is designed for a wide range of professionals, including:

  • Engineers: Electrical, materials, and quality engineers involved in the design, testing, and manufacturing of electronic components.
  • Researchers: Scientists and researchers focused on developing new materials and technologies for the electronics industry.
  • Quality Assurance Professionals: Individuals responsible for ensuring the quality and reliability of materials and components.
  • Manufacturers: Companies involved in the production of printed circuit boards, interconnection structures, and other electronic components.

Conclusion

The BS EN IEC 61189-2-805:2024 standard is an invaluable resource for anyone involved in the field of electrical materials and electronics manufacturing. By providing detailed and reliable test methods for evaluating the X/Y CTE of thin base materials, this standard ensures the highest levels of quality and performance for your products. Stay ahead of the competition and ensure the reliability of your materials with this essential standard.

Invest in the BS EN IEC 61189-2-805:2024 standard today and take the first step towards enhancing the quality and reliability of your electronic components.

DESCRIPTION

BS EN IEC 61189-2-805:2024


This standard BS EN IEC 61189-2-805:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.