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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
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immediate downloadReleased: 2021-11-05
BS EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

BS EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

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Standard number:BS EN IEC 61189-2-807:2021
Pages:14
Released:2021-11-05
ISBN:978 0 539 12605 1
Status:Standard
BS EN IEC 61189-2-807:2021 - Test Methods for Electrical Materials

BS EN IEC 61189-2-807:2021

Test Methods for Electrical Materials, Printed Boards, and Other Interconnection Structures and Assemblies

Decomposition Temperature (Td) Using TGA

Discover the latest standard in the field of electrical materials and interconnection structures with the BS EN IEC 61189-2-807:2021. This comprehensive document provides detailed test methods for evaluating the decomposition temperature (Td) of materials used in interconnection structures using Thermogravimetric Analysis (TGA).

Key Features:

  • Standard Number: BS EN IEC 61189-2-807:2021
  • Pages: 14
  • Released: 2021-11-05
  • ISBN: 978 0 539 12605 1
  • Status: Standard

This standard is essential for professionals involved in the design, manufacturing, and testing of electrical materials and printed boards. It provides a reliable method to determine the decomposition temperature, which is a critical parameter for ensuring the thermal stability and performance of materials used in electronic assemblies.

Why Choose BS EN IEC 61189-2-807:2021?

The BS EN IEC 61189-2-807:2021 standard is meticulously crafted to meet the highest industry standards. Here are some reasons why this standard is indispensable:

  • Comprehensive Coverage: The document spans 14 pages, offering in-depth information and guidelines for testing the decomposition temperature of interconnection materials.
  • Up-to-Date Information: Released on 2021-11-05, this standard incorporates the latest advancements and best practices in the field.
  • International Recognition: As a part of the IEC 61189 series, this standard is recognized and respected globally, ensuring compatibility and compliance with international norms.
  • Precision and Accuracy: The test methods outlined in this standard are designed to provide precise and accurate results, helping you maintain the highest quality standards in your products.

Applications:

The BS EN IEC 61189-2-807:2021 standard is applicable in various industries and sectors, including:

  • Electronics Manufacturing: Ensuring the reliability and performance of printed circuit boards (PCBs) and other electronic components.
  • Material Science: Evaluating the thermal properties of new and existing materials used in interconnection structures.
  • Quality Assurance: Implementing rigorous testing protocols to maintain high-quality standards in production processes.
  • Research and Development: Supporting innovation and development of new materials with enhanced thermal stability.

Understanding Decomposition Temperature (Td) Using TGA:

Thermogravimetric Analysis (TGA) is a powerful analytical technique used to measure the change in weight of a material as a function of temperature. The decomposition temperature (Td) is a critical parameter that indicates the temperature at which a material begins to decompose. This information is vital for assessing the thermal stability and suitability of materials for various applications.

The BS EN IEC 61189-2-807:2021 standard provides detailed procedures for conducting TGA tests, ensuring that you obtain accurate and reliable results. By following these guidelines, you can confidently evaluate the thermal properties of your materials and make informed decisions about their use in electronic assemblies.

Conclusion:

In the rapidly evolving field of electronics, maintaining high standards of quality and performance is crucial. The BS EN IEC 61189-2-807:2021 standard offers a comprehensive and reliable method for testing the decomposition temperature of materials used in interconnection structures. With its detailed guidelines and up-to-date information, this standard is an invaluable resource for professionals in the electronics industry.

Ensure the thermal stability and reliability of your materials by incorporating the BS EN IEC 61189-2-807:2021 standard into your testing protocols. Stay ahead of the competition and deliver products that meet the highest quality standards with this essential document.

DESCRIPTION

BS EN IEC 61189-2-807:2021


This standard BS EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 35.100.01 Open systems interconnection in general

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