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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method
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immediate downloadReleased: 2024-06-04
BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method

BS EN IEC 61189-2-808:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method

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Standard number:BS EN IEC 61189-2-808:2024
Pages:26
Released:2024-06-04
ISBN:978 0 539 15508 2
Status:Standard
BS EN IEC 61189-2-808:2024 - Test Methods for Electrical Materials

BS EN IEC 61189-2-808:2024

Test Methods for Electrical Materials, Printed Board and Other Interconnection Structures and Assemblies - Thermal Resistance of an Assembly by Thermal Transient Method

Introducing the latest standard in the field of electrical materials and interconnection structures, the BS EN IEC 61189-2-808:2024. This comprehensive document is an essential resource for professionals involved in the design, testing, and quality assurance of electrical assemblies. Released on June 4, 2024, this standard provides the most up-to-date methodologies for assessing the thermal resistance of assemblies using the thermal transient method.

Key Features and Benefits

  • Standard Number: BS EN IEC 61189-2-808:2024
  • Pages: 26
  • Release Date: 2024-06-04
  • ISBN: 978 0 539 15508 2
  • Status: Standard

This standard is meticulously crafted to ensure that it meets the highest industry requirements. It is a must-have for anyone looking to stay ahead in the rapidly evolving field of electrical materials and interconnection structures.

Comprehensive Coverage

The BS EN IEC 61189-2-808:2024 standard spans 26 pages of detailed information, providing a thorough understanding of the thermal transient method for measuring thermal resistance. This method is crucial for ensuring the reliability and performance of electrical assemblies, particularly in high-stress environments where thermal management is critical.

Why Choose BS EN IEC 61189-2-808:2024?

Choosing this standard means you are investing in a document that is recognized and respected globally. The methodologies outlined in this standard are based on extensive research and industry best practices, ensuring that you have access to the most reliable and accurate testing methods available.

Applications

The BS EN IEC 61189-2-808:2024 standard is applicable to a wide range of industries, including:

  • Electronics Manufacturing
  • Automotive Industry
  • Aerospace and Defense
  • Telecommunications
  • Consumer Electronics

Whether you are involved in the production of printed circuit boards, electronic assemblies, or other interconnection structures, this standard provides the guidelines you need to ensure your products meet the highest quality and performance standards.

Detailed Methodologies

The standard includes detailed methodologies for conducting thermal transient tests, including:

  • Preparation of test samples
  • Test setup and equipment requirements
  • Data collection and analysis
  • Interpretation of results

These methodologies are designed to be practical and easy to implement, allowing you to quickly and accurately assess the thermal resistance of your assemblies.

Global Recognition

The BS EN IEC 61189-2-808:2024 standard is recognized by industry professionals and organizations worldwide. By adhering to this standard, you demonstrate your commitment to quality and excellence, enhancing your reputation and credibility in the market.

Stay Ahead of the Curve

In the fast-paced world of electronics and interconnection structures, staying ahead of the curve is essential. The BS EN IEC 61189-2-808:2024 standard provides you with the latest knowledge and techniques, ensuring that you remain at the forefront of your industry.

Invest in Quality

Investing in the BS EN IEC 61189-2-808:2024 standard is an investment in quality. By following the guidelines and methodologies outlined in this document, you can ensure that your products meet the highest standards of performance and reliability.

Conclusion

The BS EN IEC 61189-2-808:2024 standard is an invaluable resource for anyone involved in the design, testing, and quality assurance of electrical materials and interconnection structures. With its comprehensive coverage, detailed methodologies, and global recognition, this standard is essential for ensuring the thermal performance and reliability of your assemblies.

Don't miss out on the opportunity to enhance your knowledge and expertise with the latest industry standard. Get your copy of the BS EN IEC 61189-2-808:2024 today and take the first step towards achieving excellence in your field.

DESCRIPTION

BS EN IEC 61189-2-808:2024


This standard BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.