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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-5-301:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste using fine solder particles
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BS EN IEC 61189-5-301:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste using fine solder particles

BS EN IEC 61189-5-301:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste using fine solder particles

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Standard number:BS EN IEC 61189-5-301:2021
Pages:38
Released:2021-05-06
ISBN:978 0 539 06548 0
Status:Standard
BS EN IEC 61189-5-301:2021 - Test Methods for Electrical Materials

BS EN IEC 61189-5-301:2021

Test Methods for Electrical Materials, Printed Boards, and Other Interconnection Structures and Assemblies

Discover the essential standard for ensuring the quality and reliability of electrical materials and assemblies with the BS EN IEC 61189-5-301:2021. This comprehensive document provides detailed test methods specifically designed for materials and assemblies, focusing on soldering paste using fine solder particles.

Key Features

  • Standard Number: BS EN IEC 61189-5-301:2021
  • Pages: 38
  • Release Date: 2021-05-06
  • ISBN: 978 0 539 06548 0
  • Status: Standard

Overview

The BS EN IEC 61189-5-301:2021 standard is a pivotal resource for professionals in the electronics industry, providing a framework for testing the performance and reliability of electrical materials and assemblies. This standard is particularly focused on the use of soldering paste with fine solder particles, which is crucial for modern electronic manufacturing processes.

Why Choose This Standard?

In the rapidly evolving field of electronics, maintaining high standards of quality and reliability is paramount. The BS EN IEC 61189-5-301:2021 standard offers a robust set of test methods that help manufacturers and engineers ensure their products meet the necessary performance criteria. By adhering to these guidelines, you can enhance the durability and functionality of your electronic components.

Applications

This standard is applicable to a wide range of industries and applications, including:

  • Consumer electronics
  • Automotive electronics
  • Telecommunications
  • Medical devices
  • Aerospace and defense

Benefits

Implementing the BS EN IEC 61189-5-301:2021 standard in your testing processes offers numerous benefits, such as:

  • Improved Product Quality: Ensure your products meet high-quality standards, reducing the risk of failures and recalls.
  • Enhanced Reliability: Increase the reliability of your electronic assemblies, leading to greater customer satisfaction and trust.
  • Compliance: Meet industry regulations and standards, facilitating smoother market entry and acceptance.
  • Cost Efficiency: Reduce costs associated with rework and warranty claims by identifying potential issues early in the production process.

Detailed Content

The standard comprises 38 pages of in-depth information, covering various aspects of testing methods for electrical materials and assemblies. It provides a comprehensive guide to the procedures and criteria necessary for evaluating the performance of soldering paste using fine solder particles.

Who Should Use This Standard?

This standard is an invaluable resource for:

  • Electronics manufacturers
  • Quality assurance professionals
  • Research and development teams
  • Testing laboratories
  • Engineers and technicians involved in electronic assembly

Conclusion

The BS EN IEC 61189-5-301:2021 standard is an essential tool for anyone involved in the design, production, and testing of electronic materials and assemblies. By following the guidelines set forth in this document, you can ensure that your products are of the highest quality and reliability, meeting the demands of today's competitive market.

Invest in the future of your electronic products by incorporating the BS EN IEC 61189-5-301:2021 standard into your testing and quality assurance processes. With its comprehensive test methods and focus on soldering paste using fine solder particles, this standard is your key to achieving excellence in electronic manufacturing.

DESCRIPTION

BS EN IEC 61189-5-301:2021


This standard BS EN IEC 61189-5-301:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods.