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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
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BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

BS EN IEC 61189-5-503:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

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Standard number:BS EN IEC 61189-5-503:2017
Pages:30
Released:2018-04-13
ISBN:978 0 580 91991 6
Status:Standard
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BS EN IEC 61189-5-503:2017


This standard BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards

This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).