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Homepage>BS Standards>31 ELECTRONICS>31.190 Electronic component assemblies>BS EN IEC 61190-1-3:2018 - TC Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

BS EN IEC 61190-1-3:2018 - TC

Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

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Standard number:	BS EN IEC 61190-1-3:2018 - TC
Released:	2020-02-27
ISBN:	978 0 539 11142 2
Status:	Tracked Changes

DESCRIPTION

BS EN IEC 61190-1-3:2018 - TC

This standard BS EN IEC 61190-1-3:2018 - TC Tracked Changes. Attachment materials for electronic assembly is classified in these ICS categories:

31.190 Electronic component assemblies

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the following significant technical changes with respect to the previous edition:
a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.

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