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Homepage>BS Standards>29 ELECTRICAL ENGINEERING>29.035 Insulating materials>29.035.10 Paper and board insulating materials>BS EN IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
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immediate downloadReleased: 2023-06-22
BS EN IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad

BS EN IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad

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Standard number:BS EN IEC 61249-2-51:2023
Pages:22
Released:2023-06-22
ISBN:978 0 539 18768 7
Status:Standard

BS EN IEC 61249-2-51:2023 - The Ultimate Standard for Materials for Printed Boards and Other Interconnecting Structures

Introducing the BS EN IEC 61249-2-51:2023, the latest and most comprehensive standard for materials used in printed boards and other interconnecting structures. This standard is a must-have for professionals in the electronics industry, providing detailed guidelines for reinforced base materials, both clad and unclad, as well as base materials for integrated circuit card carrier tape, unclad.

Key Features

The BS EN IEC 61249-2-51:2023 standard is packed with 22 pages of in-depth information, ensuring you have all the knowledge you need to select and use these materials effectively. Released on June 22, 2023, this standard is the most up-to-date resource available, reflecting the latest industry trends and technological advancements.

With its unique ISBN number, 978 0 539 18768 7, this standard is easy to reference and locate, making it a convenient addition to your professional library. As a standard, it carries the weight of authority, ensuring that the information it contains is reliable and trustworthy.

Why Choose BS EN IEC 61249-2-51:2023?

The BS EN IEC 61249-2-51:2023 standard is a comprehensive guide to materials for printed boards and other interconnecting structures. It provides detailed specifications for reinforced base materials, both clad and unclad, as well as base materials for integrated circuit card carrier tape, unclad. This makes it an invaluable resource for professionals in the electronics industry, who need to ensure that their products meet the highest standards of quality and performance.

By following the guidelines in this standard, you can ensure that your products are built to last, with materials that are durable, reliable, and fit for purpose. This can help to enhance the reputation of your brand, increase customer satisfaction, and ultimately boost your bottom line.

Invest in Quality with BS EN IEC 61249-2-51:2023

When it comes to the materials used in your products, you can't afford to compromise on quality. That's why the BS EN IEC 61249-2-51:2023 standard is such a valuable resource. It provides the detailed information you need to make informed decisions about the materials you use, helping you to deliver products that meet the highest standards of quality and performance.

Don't miss out on this essential resource for professionals in the electronics industry. Invest in the BS EN IEC 61249-2-51:2023 standard today, and ensure that your products are built to the highest standards.

Remember, quality is not an act, it's a habit. Make it your habit with the BS EN IEC 61249-2-51:2023 standard.

DESCRIPTION

BS EN IEC 61249-2-51:2023


This standard BS EN IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 29.035.10 Paper and board insulating materials
  • 31.180 Printed circuits and boards
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.