BS EN IEC 61760-3:2021: Surface Mounting Technology Standard

Welcome to the future of electronic component assembly with the BS EN IEC 61760-3:2021 standard. This comprehensive document is your essential guide to the specification of components for through-hole reflow (THR) soldering, a critical process in modern electronics manufacturing. Released on March 18, 2021, this standard is the latest in surface mounting technology, ensuring that your components meet the highest quality and performance benchmarks.

Overview of the Standard

The BS EN IEC 61760-3:2021 standard provides a detailed methodology for specifying components used in through-hole reflow soldering. This process is integral to the assembly of electronic devices, where components are mounted on the surface of printed circuit boards (PCBs) using solder paste and then reflowed in an oven. This standard ensures that components are designed and manufactured to withstand the thermal and mechanical stresses of the reflow process, thereby enhancing the reliability and longevity of electronic assemblies.

Key Features

• Standard Number: BS EN IEC 61760-3:2021
• Pages: 34
• Release Date: March 18, 2021
• ISBN: 978 0 539 04585 7
• Status: Standard

Why Choose BS EN IEC 61760-3:2021?

In the fast-paced world of electronics, staying ahead of the curve is crucial. The BS EN IEC 61760-3:2021 standard is designed to help manufacturers and engineers achieve just that. By adhering to this standard, you ensure that your components are compatible with the latest surface mounting technologies, reducing the risk of defects and improving the overall quality of your products.

This standard is particularly beneficial for:

• Electronics Manufacturers: Ensure your components meet international quality standards, enhancing your reputation and competitiveness in the global market.
• Design Engineers: Gain a comprehensive understanding of the requirements for through-hole reflow soldering, enabling you to design more reliable and efficient electronic assemblies.
• Quality Assurance Professionals: Use this standard as a benchmark for evaluating the quality and performance of components, ensuring compliance with industry regulations.

Comprehensive Coverage

The BS EN IEC 61760-3:2021 standard spans 34 pages of in-depth information, covering all aspects of through-hole reflow soldering. From the specification of component dimensions and materials to the testing and evaluation of solderability, this standard provides a complete framework for ensuring the highest quality in electronic assembly.

Topics Covered Include:

• Component design and material specifications
• Solderability testing and evaluation
• Thermal and mechanical stress considerations
• Quality assurance and compliance guidelines

Stay Ahead with the Latest Standards

In an industry where technology is constantly evolving, keeping up with the latest standards is essential. The BS EN IEC 61760-3:2021 standard is your key to staying ahead in the competitive world of electronics manufacturing. By implementing the guidelines and specifications outlined in this standard, you can ensure that your products are not only compliant with current industry requirements but also optimized for future advancements in surface mounting technology.

Conclusion

Investing in the BS EN IEC 61760-3:2021 standard is an investment in the future of your business. With its comprehensive guidelines and specifications, this standard is an invaluable resource for anyone involved in the design, manufacture, or quality assurance of electronic components. Ensure your products meet the highest standards of quality and performance by integrating the principles of this standard into your processes today.

BS EN IEC 61760-3:2021

This standard BS EN IEC 61760-3:2021 Surface mounting technology is classified in these ICS categories:

• 31.190 Electronic component assemblies

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.