BS EN IEC 62148-21:2021
Fibre optic active components and devices. Package and interface standards Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
| Standard number: | BS EN IEC 62148-21:2021 |
| Pages: | 20 |
| Released: | 2021-06-15 |
| ISBN: | 978 0 539 13576 3 |
| Status: | Standard |
BS EN IEC 62148-21:2021 Fibre Optic Active Components and Devices
Welcome to the future of fibre optic technology with the BS EN IEC 62148-21:2021 standard. This comprehensive guide is essential for anyone involved in the design and implementation of fibre optic active components and devices. Released on June 15, 2021, this standard is a cornerstone for ensuring compatibility and efficiency in the rapidly evolving field of fibre optics.
Overview
The BS EN IEC 62148-21:2021 standard provides detailed design guidelines for the electrical interface of Photonic Integrated Circuit (PIC) packages. It focuses on the use of silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) technologies. These guidelines are crucial for engineers and designers who are looking to optimize the performance and reliability of fibre optic components.
Key Features
- Standard Number: BS EN IEC 62148-21:2021
- Pages: 20
- Release Date: June 15, 2021
- ISBN: 978 0 539 13576 3
- Status: Standard
Why Choose This Standard?
In the competitive world of fibre optics, staying ahead of the curve is crucial. The BS EN IEC 62148-21:2021 standard offers a wealth of information that can help you achieve just that. By adhering to these guidelines, you can ensure that your designs are not only compliant with international standards but also optimized for performance and reliability.
Benefits of Using S-FBGA and S-FLGA
The use of silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) technologies offers several advantages:
- High Density: These technologies allow for a higher density of connections, which is essential for modern, compact designs.
- Improved Performance: By reducing the distance between connections, these technologies can improve the overall performance of the device.
- Reliability: The robust design of S-FBGA and S-FLGA ensures long-term reliability, even in demanding environments.
Applications
The guidelines provided in this standard are applicable to a wide range of industries and applications, including:
- Telecommunications: Enhance the performance and reliability of communication networks.
- Data Centers: Optimize the efficiency of data transmission and processing.
- Consumer Electronics: Improve the functionality and durability of electronic devices.
- Automotive: Ensure the reliability of communication systems in vehicles.
Comprehensive and Authoritative
With 20 pages of in-depth information, the BS EN IEC 62148-21:2021 standard is a comprehensive resource for anyone involved in the design and implementation of fibre optic components. Its authoritative guidelines are based on the latest research and technological advancements, ensuring that you have access to the most current and relevant information.
Conclusion
Incorporating the BS EN IEC 62148-21:2021 standard into your design process is a strategic move that can significantly enhance the quality and performance of your fibre optic components. Whether you are an engineer, designer, or manufacturer, this standard provides the tools and knowledge you need to succeed in the fast-paced world of fibre optics.
Embrace the future of fibre optic technology with the BS EN IEC 62148-21:2021 standard and ensure that your designs are at the forefront of innovation and efficiency.
BS EN IEC 62148-21:2021
This standard BS EN IEC 62148-21:2021 Fibre optic active components and devices. Package and interface standards is classified in these ICS categories:
- 33.180.01 Fibre optic systems in general
- 33.180.20 Fibre optic interconnecting devices
IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).