BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
| Standard number: | BS EN IEC 62878-1:2019 |
| Pages: | 26 |
| Released: | 2019-12-17 |
| ISBN: | 978 0 580 97304 8 |
| Status: | Standard |
BS EN IEC 62878-1:2019 Device Embedding Assembly Technology
Welcome to the future of electronic assembly with the BS EN IEC 62878-1:2019 standard, a comprehensive guide to device embedding assembly technology. This standard is a must-have for professionals in the electronics industry who are looking to stay ahead of the curve in the rapidly evolving field of device embedded substrates.
Overview
The BS EN IEC 62878-1:2019 standard provides a generic specification for device embedded substrates, offering a detailed framework for the integration of devices within substrates. Released on December 17, 2019, this standard is a pivotal resource for ensuring the reliability and efficiency of embedded device assemblies.
Key Features
- Standard Number: BS EN IEC 62878-1:2019
- Pages: 26
- ISBN: 978 0 580 97304 8
- Status: Standard
Why Choose BS EN IEC 62878-1:2019?
In the competitive world of electronics, staying updated with the latest standards is crucial. The BS EN IEC 62878-1:2019 standard is designed to help you achieve excellence in device embedding assembly technology. Here are some reasons why this standard is indispensable:
Comprehensive Guidance
This standard offers a thorough understanding of the processes involved in embedding devices within substrates. It covers everything from the basic principles to advanced techniques, ensuring that you have all the information you need to implement this technology effectively.
Enhanced Reliability
By adhering to the guidelines set out in this standard, you can significantly enhance the reliability of your embedded device assemblies. This is crucial for maintaining the performance and longevity of electronic products.
Industry Compliance
Compliance with the BS EN IEC 62878-1:2019 standard ensures that your products meet the latest industry requirements. This not only boosts your credibility but also opens up new opportunities in the global market.
Future-Proof Your Technology
As technology continues to evolve, staying ahead of the curve is essential. This standard equips you with the knowledge and tools needed to future-proof your technology, ensuring that you remain competitive in the ever-changing electronics landscape.
Who Should Use This Standard?
The BS EN IEC 62878-1:2019 standard is ideal for a wide range of professionals in the electronics industry, including:
- Electronic Engineers
- Product Designers
- Quality Assurance Specialists
- Manufacturing Technicians
- Research and Development Teams
Conclusion
Incorporating the BS EN IEC 62878-1:2019 standard into your processes is a strategic move that can lead to significant improvements in the quality and performance of your electronic products. With its comprehensive guidelines and focus on reliability, this standard is an invaluable resource for anyone involved in device embedding assembly technology.
Stay ahead of the competition and ensure your products meet the highest standards of quality and performance with the BS EN IEC 62878-1:2019 standard. Embrace the future of electronics with confidence and precision.
BS EN IEC 62878-1:2019
This standard BS EN IEC 62878-1:2019 Device embedding assembly technology is classified in these ICS categories:
- 31.190 Electronic component assemblies
- 31.180 Printed circuits and boards
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.