BS EN IEC 62878-2-5:2019 - Device Embedding Assembly Technology Guidelines

Welcome to the future of electronic assembly technology with the BS EN IEC 62878-2-5:2019 standard. This comprehensive guideline is your gateway to mastering the implementation of a 3D data format for device embedded substrates. Released on November 18, 2019, this standard is a pivotal resource for professionals in the field of electronics and assembly technology.

Overview

The BS EN IEC 62878-2-5:2019 standard is a crucial document that provides detailed guidelines for the implementation of a 3D data format specifically designed for device embedded substrates. This standard is part of a series that focuses on device embedding assembly technology, offering a structured approach to integrating devices within substrates, which is a key advancement in modern electronics manufacturing.

Key Features

• Standard Number: BS EN IEC 62878-2-5:2019
• Pages: 58
• Release Date: November 18, 2019
• ISBN: 978 0 580 96583 8
• Status: Standard

Why This Standard is Essential

In the rapidly evolving world of electronics, the need for efficient and reliable assembly technologies is paramount. The BS EN IEC 62878-2-5:2019 standard addresses this need by providing a robust framework for the implementation of 3D data formats. This is particularly important for device embedded substrates, which are becoming increasingly prevalent in advanced electronic applications.

By adhering to this standard, manufacturers and engineers can ensure that their products meet the highest levels of quality and performance. The guidelines outlined in this document help streamline the design and manufacturing process, reducing errors and improving overall efficiency.

Benefits of Implementing 3D Data Formats

The implementation of 3D data formats as outlined in this standard offers numerous benefits, including:

• Enhanced Design Flexibility: 3D data formats allow for more complex and intricate designs, enabling the creation of more compact and efficient electronic devices.
• Improved Performance: By embedding devices directly into substrates, manufacturers can reduce the size and weight of electronic components, leading to improved performance and reliability.
• Cost Efficiency: Streamlining the assembly process with 3D data formats can lead to significant cost savings in both materials and labor.
• Future-Proofing: As technology continues to advance, the ability to implement 3D data formats will become increasingly important, ensuring that your products remain competitive in the market.

Who Should Use This Standard?

The BS EN IEC 62878-2-5:2019 standard is an invaluable resource for a wide range of professionals, including:

• Electronics Engineers
• Manufacturing Specialists
• Product Designers
• Quality Assurance Professionals
• Research and Development Teams

Whether you are involved in the design, manufacturing, or quality assurance of electronic components, this standard provides the guidelines you need to excel in your field.

Conclusion

In conclusion, the BS EN IEC 62878-2-5:2019 standard is a vital tool for anyone involved in the field of electronics assembly technology. By providing clear and concise guidelines for the implementation of 3D data formats, this standard helps ensure that your products are at the forefront of innovation and quality.

Embrace the future of electronics manufacturing with the BS EN IEC 62878-2-5:2019 standard and take your products to the next level of performance and reliability.

BS EN IEC 62878-2-5:2019

• 31.190 Electronic component assemblies
• 31.180 Printed circuits and boards

This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.

This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.

This part of IEC 62878 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.