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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 62878-2-602:2021 Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
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immediate downloadReleased: 2021-08-20
BS EN IEC 62878-2-602:2021 Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

BS EN IEC 62878-2-602:2021

Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

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Standard number:BS EN IEC 62878-2-602:2021
Pages:18
Released:2021-08-20
ISBN:978 0 539 04645 8
Status:Standard
BS EN IEC 62878-2-602:2021 Device Embedding Assembly Technology Guideline

BS EN IEC 62878-2-602:2021 Device Embedding Assembly Technology Guideline for Stacked Electronic Module

Standard Number: BS EN IEC 62878-2-602:2021

Pages: 18

Released: 2021-08-20

ISBN: 978 0 539 04645 8

Name: Device Embedding Assembly Technology Guideline for Stacked Electronic Module. Evaluation Method of Inter-Module Electrical Connectivity

Status: Standard

Overview

The BS EN IEC 62878-2-602:2021 is a comprehensive standard that provides guidelines for device embedding assembly technology, specifically focusing on stacked electronic modules. This standard is essential for professionals in the electronics industry who are involved in the design, manufacturing, and evaluation of electronic modules. Released on August 20, 2021, this 18-page document is a crucial resource for ensuring the reliability and performance of inter-module electrical connectivity.

Key Features

  • Comprehensive Guidelines: This standard offers detailed guidelines for the assembly technology of stacked electronic modules, ensuring that all aspects of the process are covered.
  • Evaluation Methods: It provides specific methods for evaluating the electrical connectivity between modules, which is critical for the performance and reliability of the final product.
  • Industry Relevance: As a standard recognized by the industry, it ensures that your processes and products meet the highest quality and reliability standards.
  • Up-to-Date Information: Released in 2021, this standard includes the latest advancements and best practices in device embedding assembly technology.

Why This Standard is Important

In the rapidly evolving field of electronics, maintaining high standards of quality and reliability is paramount. The BS EN IEC 62878-2-602:2021 standard is designed to help professionals achieve these goals by providing a clear and detailed framework for the assembly and evaluation of stacked electronic modules. By adhering to this standard, you can ensure that your products are not only compliant with industry regulations but also optimized for performance and durability.

Who Should Use This Standard?

This standard is ideal for a wide range of professionals in the electronics industry, including:

  • Design Engineers: Gain insights into the best practices for designing stacked electronic modules.
  • Manufacturing Engineers: Ensure that your assembly processes meet the highest standards of quality and reliability.
  • Quality Assurance Professionals: Use the evaluation methods provided to verify the electrical connectivity and overall performance of your modules.
  • Compliance Officers: Ensure that your products meet industry standards and regulations.

Detailed Content

The BS EN IEC 62878-2-602:2021 standard is divided into several sections, each focusing on a specific aspect of device embedding assembly technology. These sections include:

  • Introduction: An overview of the standard and its objectives.
  • Scope: Defines the range of applications and limitations of the standard.
  • Normative References: Lists other standards and documents referenced in this standard.
  • Terms and Definitions: Provides clear definitions of key terms used throughout the document.
  • General Requirements: Outlines the general requirements for device embedding assembly technology.
  • Specific Requirements: Details the specific requirements for stacked electronic modules.
  • Evaluation Methods: Describes the methods for evaluating inter-module electrical connectivity.
  • Annexes: Includes additional information and examples to support the main content.

Benefits of Using This Standard

Adopting the BS EN IEC 62878-2-602:2021 standard offers numerous benefits, including:

  • Enhanced Reliability: By following the guidelines and evaluation methods, you can ensure that your electronic modules are reliable and perform as expected.
  • Improved Quality: The standard helps you maintain high-quality standards throughout the assembly process.
  • Regulatory Compliance: Ensure that your products meet industry regulations and standards.
  • Competitive Advantage: By adhering to recognized standards, you can differentiate your products in the market and gain a competitive edge.

Conclusion

The BS EN IEC 62878-2-602:2021 standard is an invaluable resource for professionals in the electronics industry. It provides comprehensive guidelines and evaluation methods for device embedding assembly technology, specifically for stacked electronic modules. By adhering to this standard, you can ensure that your products meet the highest standards of quality, reliability, and performance. Whether you are a design engineer, manufacturing engineer, quality assurance professional, or compliance officer, this standard will help you achieve your goals and maintain a competitive edge in the market.

DESCRIPTION

BS EN IEC 62878-2-602:2021


This standard BS EN IEC 62878-2-602:2021 Device embedding assembly technology is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.